Intel Large And Small Core Processor Processor, Cpu Is Powerful, But Gpu Efficiency Is Weak.

Although Intel processor (Intel) has not developed smoothly on mobile processors. However, Intel has not completely abandoned the mobile market. Because of foreign media reports, Intel will use a 10 nanometer process to produce a single chip processor, named Lakefield, and import the bigLITTLE size core architecture of the ARM processor, which will make the CPU of the single chip processor more efficient than the high pass processor.

The report points out that the bigLITTLE size core design architecture of ARM is a high performance core in CPU, and there is a low power core to mobilize different cores for different applications in order to achieve the goal of balancing performance and power consumption. Currently including high pass 845 and 835, HUAWEI kylin 960 and 970, the Helio series processors of the United States, all use the bigLITTLE architecture, which is generally the design of 4 core + 4 core.

For Intel, their single chip processors also hope to solve the problem of performance and power consumption. At present, the Intel hands also have high performance X86 core, and also for low power platform Atom processor technology, the size and size of the core design seems to be an inevitable trend. Therefore, there has been a rumor that Intel will launch the Lakefield core single chip processor produced by the 10 nanometer process. The core is the high-performance Ice Lake architecture, and the low power core is the new generation of Atom kernel Tremont.

The report further points out that the CPU performance of the Lakefield designed by the size core will be stronger than the high pass processor, but the GPU performance may be the weakness of the rod processor. Because it uses Intel Gen11 graphics architecture, which is better than the current Gen9/9.5. However, Qualcomm has always had a great advantage in the field of action GPU, and no matter Samsung, Hester, or the coalition, there is no Andero GPU status that can shake high Qualcomm. As a result, Lakefield is temporarily unable to surpass the advantages of Qualcomm in this regard.

Finally, in the release time of Lakefield, it was said that it was in the 2019 World Communications Conference (MWC), that is, between 2 and March 2019. However, when Intel's 10 nanometers of production has been announced late again, whether Lakefield can catch up with the mass production before 2019 is still undetermined. Therefore, the correct release time of Lakefield must wait for the further announcement by Intel officials.